Electronics Encapsulation & Cable Assembly Overmoulding
Nordell provides electronics encapsulation and cable overmoulding solutions designed to protect sensitive assemblies in demanding environments.
Using precision injection moulding techniques, we encapsulate PCBs, connectors and cable assemblies to improve mechanical strength, environmental resistance and long-term reliability.
If your product requires robust protection without compromising component integrity, our encapsulation solutions provide a controlled, repeatable alternative to traditional potting.
What is Electronics Encapsulation?
Electronics encapsulation involves moulding a protective polymer layer around electronic assemblies to reinforce and seal critical areas.
Unlike potting, which fills an enclosure with resin, injection overmoulding precisely forms a structural outer layer around selected parts of the assembly.
This allows for:
- Targeted reinforcement
- Integrated strain relief
- Defined sealing geometry
- Clean, production-ready housings
Encapsulation through injection moulding offers greater dimensional control and consistency compared with manual or bulk resin-based processes.
Why Encapsulate Electronic Components?
- Protection for Sensitive ComponentEncapsulation shields PCBs, connectors and cable terminations from vibration, moisture, impact and environmental exposure, improving long-term reliability.
- Low-Pressure Overmoulding CapabilityLow-pressure overmoulding protects delicate electronic assemblies by carefully controlling heat and injection force, reducing the risk of component stress or damage.
- Integrated Cable StrengtheningOvermoulded cable exits and connectors provide built-in strain relief, improved flexural strength and enhanced sealing for demanding applications.
Low-Pressure Encapsulation for Sensitive Electronics
For delicate PCBs and sensitive components, we offer low-pressure overmoulding solutions.
This process carefully manages injection force, temperature and material flow to minimise mechanical and thermal stress on internal electronics.
Low-pressure overmoulding is particularly suited to:
- Fine circuitry
- Sensor modules
- Compact assemblies
- Temperature-sensitive components
By controlling processing conditions, we ensure protection is added without compromising functionality.
Cable Assembly and Connector Overmoulding
Cable overmoulding forms part of our electronics encapsulation capability.
The cable assembly is positioned within a mould tool, and polymer is injected around the connector and termination area.
Once cooled, this creates a unified protective housing around what is typically the most vulnerable section of the assembly.
Key advantages include:
- Increased flexural strength at cable exits
- Built-in strain relief
- Improved resistance to abrasion and shock
- Sealed connections for demanding environments
- Enhanced appearance and product durability
Electronics Encapsulation as an Alternative to Potting
Traditional potting involves filling an enclosure with resin to protect electronics.
While effective in some applications, it can limit serviceability, increase weight and reduce design flexibility.
Injection encapsulation offers a structured, repeatable alternative by forming a protective housing exactly where it is required.
This approach allows:
- Controlled material placement
- Defined external geometry
- Reduced excess material use
- Greater production consistency
To explore this further, read our article on overmoulding electronics without potting.
